Solder Paste No-Clean Low Temp


15 g, Sn42/Bi57.6/Ag0.4, REL0

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Chip Quik® solder paste is good past its quoted shelf life, regardless of refrigeration. Before use, visually inspect the solder paste to ensure it is not dried out or clumpy, or check stencil release. If stored in a jar, stir the product thoroughly for 2-3 minutes before inspection and use.
Printing speeds up to 100mm/sec Long stencil life
Wide process window
Clear residue
Excellent wetting compatibility on most board finishes Dispense grade
Compatible with enclosed print heads
RoHS II and REACH compliant
Low voiding

Alloy: Sn42/Bi57.6/Ag0.4
Mesh Size: T3
Micron (μm) Range: 25-45
Flux Type: Synthetic No-Clean
Flux Classification: REL0
Metal Load: 87% Metal by Weight
Melting Point: 138°C (281°F)
Packaging: 5cc/15g Syringe
Shelf Life: Refrigerated >6 months, Unrefrigerated >2 months


Kaal 29.1 g
Mõõtmed 8 × 13 × 3 cm


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