Chip Quik® solder paste is good past its quoted shelf life, regardless of refrigeration. Before use, visually inspect the solder paste to ensure it is not dried out or clumpy, or check stencil release. If stored in a jar, stir the product thoroughly for 2-3 minutes before inspection and use.
Printing speeds up to 100mm/sec Long stencil life Wide process window Clear residue
Excellent wetting compatibility on most board finishes Dispense grade Compatible with enclosed print heads RoHS II and REACH compliant
Mesh Size: T3 Micron (μm) Range: 25-45
Flux Type: Synthetic No-Clean Flux Classification: REL0
Metal Load: 87% Metal by Weight Melting Point: 138°C (281°F)
Packaging: 5cc/15g Syringe Shelf Life: Refrigerated >6 months, Unrefrigerated >2 months