Chip Quik® solder paste is good past its quoted shelf life, regardless of refrigeration. Before use, visually inspect the solder paste to ensure it is not dried out or clumpy, or check stencil release. If stored in a jar, stir the product thoroughly for 2-3 minutes before inspection and use.
Revolutionary Formula: No Refrigeration Required!
Printing speeds up to 125mm/sec Long stencil life Wide process window
Low voiding Excellent wetting compatibility on most board finishes Dispense grade Compatible with enclosed print heads REACH Compliant
Alloy: Sn63/Pb37 Mesh Size: T4 Micron (μm) Range: 20-38
Flux Type: Synthetic No-Clean Flux Classification: ROL0
Metal Load: 88% Metal by Weight Melting Point: 183°C (361°F)
Packaging: 5cc/15g Syringe
Shelf Life: Refrigerated >12 months, Unrefrigerated >12 months